Universal Electronics is equipped for both Surface Mount and Thru-Hole technologies. Our six SMT lines are capable of component placement to 12 mil pitch and offer BGA compatibility. Our two high speed chipshooters and eight pick & place machines will get the surface mount placements done fast and accurate.
Our Thru-Hole placement lines are equipped with multiple DIP and axial automated insertion machines. Our most recent addition for leaded device placement is our ERSA VersaFlow. This allows us to automate certain hand soldering processes for faster, more consistent soldering.
Our PCB Coating, Potting, and Final Assembly put the finishing touches on our full service manufacturing. If you application requires a board to be coated, encapsulated, or wired into an enclosure, our assembly lines are more than suited to meet your requirements.
Please browse through our SMT, Thru-Hole, PCB Coating & Potting, and Final Assembly manufacturing services to see how we can meet your production needs.

SMT Manufacturing

Supporting SMT Capablities

• Six Production Lines
• Component Placement to 12mil pitch
• BGA Capability
• Design Reviews
• PCB Panelization Schemes
• Documentation Process Control
• Strict ESD Controls
• Multi-Profile Convection Reflow Chambers
• Rework Stations

Primary SMT Equipment

• Universal 4782 & 4791 High Speed Chipshooters (2)
• Universal GSM1 Pick & Place Machines (2)
• Universal 4766 SFP Pick & Place Machines (2)
• Universal 4621B Pick & Place Machines (4)
• Hi Speed Adhesive Dispensing Machines
• In-Line and Vision Assist Screen Printers
• In-Line Convection and IR Reflow Ovens

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Thru-Hole Manufacturing

Supporting Thru-Hole Capablities

• Automated Lead Forming and Trimming Equipment
• Automated Wire Processing and Terminations
• Wire Harness and Cable Assemblies
• Programmable Hand Insertion Equipment
• Automated Mask Dispensing Systems
• Complete Toolroom Facilities

Primary Thru-Hole Equipment

• Amistar Al 6448 Axial Inserters (5)
• Amistar Cl 3000 Dip Inserters (2)
• Universal 6796 Dip Inserter
• Universal 6772 Dip Inserter
• Universal 2596R Sequencer
• Wave Soldering Systems (5)
• In-Line Aqueous Cleaning Systems (2)
• ERSA VersaFlow

• Conformal (Dip or Spray)
• Parylene
• Automated Potting Equipment
• Encapsulation

• Mechanical / Electromechanical Assemblies
• Complete or Partial Product Assembly and Testing
• Hard Wiring
• Custom Packaging

Last Updated: Tuesday, April 2, 2002
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